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Crystals, Oscillators, Resonators Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Packaging | Series | Part Status | Communication Type | Frequency Band (MHz) | LTE Data Rate (Mbps) | HSPA Plus Data Rate ... | HSPA Data Rate (Mbps) ... | UMTS Data Rate (Kbps) ... | CDMA Data Rate (Mbps) ... | WCDMA Data Rate (Kbps) ... | TD-SCDMA Data Rate ... | EDGE Data Rate (Kbps) ... | GPRS Data Rate (Kbps) ... | Protocols | Features | GNSS | Interfaces | Audio | SIM Interface | Embedded FW | Voltage - Supply | Power Consumption | Package / Case | Dimensions | Weight (approx.) | Temperature Range | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CQA2-4P-0P | CQA2-4P-0P | Leadtime 3 - 4 weeks | Quectel | Multi-mode Smart LTE Module with Wi-Fi & Bluetooth with Android OS | Tape & Reel TR | - | Active | LTE Cat 4 | LTE FDD: B1 B3 B8 LTE TDD: B38 B39 B40 B41 TDSCDMA: B34 B39 EVDO CDMA: BC0 WCDMA: B1 B8 GSM: 900 1800MHz | 150 DL 50 UL | 42 DL 5.76 UL | - | - | - | 384 DL&UL | 4.2 DL 2.2 UL | 236.8 DL&UL | 85.6 DL&UL | 0 | 2.4G, 802.11 b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR-WB | Dual SIM 1.8V 2.95V | Android | 3.5V - 4.2V | - | 146-pin LCC & 64-pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | -40¡C ~ 75¡C | |||
| 1FA-W6C-ZW | 1FA-W6C-ZW | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| H1-SD-RN | H1-SD-RN | Leadtime 3 - 4 weeks | Quectel | Multi-mode Smart LTE Module with Wi-Fi & Bluetooth with Android OS | Tape & Reel TR | - | Active | LTE Cat 4 | FDD LTE: B1 B3 B8 B18 B19 B26 TDD LTE: B41 WCDMA: B1 B6 B19 | 150 DL 50 UL | 42 DL 5.76 UL | - | - | - | 384 DL&UL | - | - | - | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR-WB | Dual SIM 1.8V 2.95V | Android | 3.5V - 4.2V | - | 146-pin LCC & 64-pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | -40¡C ~ 75¡C | |||
| CZK-ME-O8F | CZK-ME-O8F | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | LTE FDD: B1 B3 B8 LTE TDD: B38 B39 B40 B41 TDSCDMA: B34 B39 EVDO CDMA: BC0 WCDMA: B1 B8 GSM: 900 1800MHz | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 4.2 DL 2.2 UL | 236.8 DL&UL | 85.6 DL&UL | 0 | 2.4G, 802.11 b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||
| UJNW-N5-R2M | UJNW-N5-R2M | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | FDD LTE: B1 B3 B8 B18 B19 B26 TDD LTE: B41 WCDMA: B1 B6 B19 | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | |||||||||||
| 5JD-XJ-0P | 5JD-XJ-0P | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| 3RW43 JFSW CLK | 3RW43 JFSW CLK | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | LTE FDD: B1 B3 B8 LTE TDD: B38 B39 B40 B41 TDSCDMA: B34 B39 EVDO CDMA: BC0 WCDMA: B1 B8 GSM: 900 1800MHz | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 4.2 DL 2.2 UL | 236.8 DL&UL | 85.6 DL&UL | 0 | 2.4G, 802.11 b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||
| 9MNH-DY5E-AG | 9MNH-DY5E-AG | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version SB | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| DQET6-RK-E12 | DQET6-RK-E12 | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| GU G9U KB | GU G9U KB | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version SB | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| D5KQ-AH2-O8 | D5KQ-AH2-O8 | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| MAI2D NT 9J7 | MAI2D NT 9J7 | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | FDD LTE: B1 B3 B8 B18 B19 B26 TDD LTE: B41 WCDMA: B1 B6 B19 | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | |||||||||||
| QWZQ8-M9-6A | QWZQ8-M9-6A | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version SB | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| NA-WZSH-8X | NA-WZSH-8X | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | FDD LTE: B1 B3 B8 B18 B19 B26 TDD LTE: B41 WCDMA: B1 B6 B19 | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | |||||||||||
| UX 45Z A27 | UX 45Z A27 | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | FDD LTE: B1 B3 B5 B7 B8 B20 TDD LTE: B38 B40 B41 WCDMA: B1 B5 B8 GSM: 850 900 1800 1900MHz | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 236.8 DL&UL | 85.6 DL&UL | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | |||||||||
| ISDY0-2O-4CU | ISDY0-2O-4CU | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | FDD LTE: B1 B3 B5 B7 B8 B28 TDD LTE: B40 WCDMA: B1 B2 B5 B8 GSM: 850 900 1800 1900MHz | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 236.8 DL&UL | 85.6 DL&UL | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | |||||||||
| VT-A4-KKW | VT-A4-KKW | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | FDD LTE: B1 B3 B5 B7 B8 B20 TDD LTE: B38 B40 B41 WCDMA: B1 B5 B8 GSM: 850 900 1800 1900MHz | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 236.8 DL&UL | 85.6 DL&UL | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | |||||||||
| 8PF-8YJ1-69 | 8PF-8YJ1-69 | Leadtime 3 - 4 weeks | Quectel | Smart Module with Wi-Fi & Bluetooth with Android OS, HW version SB | Tape & Reel TR | - | Active | - | - | - | - | - | - | - | - | - | - | - | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR-WB | Dual SIM 1.8V 2.95V | Android | 3.5V - 4.2V | - | 146-pin LCC & 64-pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | -40¡C ~ 75¡C | |||
| 1M-EN-CGL | 1M-EN-CGL | Leadtime 3 4 weeks | Quectel | Multi mode Smart LTE Module with Wi Fi & Bluetooth with Android OS | Tape & Reel TR | Active | LTE Cat 4 | FDD LTE: B1 B3 B8 B18 B19 B26 TDD LTE: B41 WCDMA: B1 B6 B19 | 150 DL 50 UL | 42 DL 5.76 UL | 384 DL&UL | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | |||||||||||
| CF0 MOZ B1 | CF0 MOZ B1 | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| GQW4X VR 3DO | GQW4X VR 3DO | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| 1HY-80LE-XO2 | 1HY-80LE-XO2 | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| AMT-2DOD-CUX | AMT-2DOD-CUX | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| GI6N 2T LQ | GI6N 2T LQ | Leadtime 3 4 weeks | Quectel | Smart Module with Wi Fi & Bluetooth with Android OS, HW version A | Tape & Reel TR | Active | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR WB | Dual SIM 1.8V 2.95V | Android | 3.5V 4.2V | 146 pin LCC & 64 pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | 40¡C ~ 75¡C | ||||||||||||||||
| WQPE-IENP-EOX | WQPE-IENP-EOX | Leadtime 3 - 4 weeks | Quectel | Multi-mode Smart LTE Module with Wi-Fi & Bluetooth with Android OS | Tape & Reel TR | - | Active | LTE Cat 4 | FDD LTE: B1 B3 B8 B18 B19 B26 TDD LTE: B41 WCDMA: B1 B6 B19 | 150 DL 50 UL | 42 DL 5.76 UL | - | - | - | 384 DL&UL | - | - | - | 0 | 2.4G 5.8G, 802.11 a b g n BT BT2.1+EDR 3.0 4.1 LE | GPS GLONASS BeiDou | LCM, Camera, Touch Panel, Audio, Video, USB, I2C, UART, GPIO, SDIO, ADC | HR, FR, EFR, AMR, AMR-WB | Dual SIM 1.8V 2.95V | Android | 3.5V - 4.2V | - | 146-pin LCC & 64-pin LGA | 40.5mm L x 40.5mm W x 2.8 mm H | 9.8 g | -40¡C ~ 75¡C | |||
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