ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
14-8870-10
14-8870-10
50+3
Increments of 50
88PT-9ND4-3WBCONN IC DIP SOCKET 14POS TINBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
110-91-422-41-001000
110-91-422-41-001000
54+11.1057
270+3.06449
540+1.81765
Increments of 54
Leadtime
2-3 weeks		SZQ-H4-YUCONN IC DIP SOCKET 22POS GOLDTube110ActiveDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
122-87-624-41-001101
122-87-624-41-001101
476+1.77402
Increments of 476
Leadtime
2-3 weeks		MUXOT-8P6S-GUVCONN IC DIP SOCKET 24POS GOLDTube122ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
RE-FQ-9O
RE-FQ-9O
Leadtime
2-3 weeks		ID6-Q40-HJJCONN IC DIP SOCKET 20POS GOLDBulk100ObsoleteDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C
2DCB RR7I NLP
2DCB RR7I NLP
2+35.6716
Increments of 2
Leadtime
2 3 weeks		VEL8-2Y-Y5DCONN IC DIP SOCKET 40POS GOLDBulk6556ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder Cup0.100 2.54mm Tin200µin 5.08µm BrassPolyphenylene Sulfide PPS , Glass Filled
21-0508-20
21-0508-20
15+7.50588
Increments of 15
Leadtime
2-3 weeks		EA-C3B3-ZTCONN SOCKET SIP 21POS GOLDBulk508ActiveSIP21 1 x 21 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 105°C
614-93-624-31-012000
614-93-624-31-012000
336+2.48838
Increments of 336
Leadtime
2-3 weeks		KW6IC-1UY-YSCONN IC DIP SOCKET 24POS GOLDTube614ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
3-822516-7-Cut
3-822516-7
Leadtime
2-3 weeks		SMQZN-GWL3-WFCONN SOCKET PLCC 32POS TINCut Tape CT -ObsoletePLCC32 2 x 7, 2 x 9 0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin100µin 2.54µm Phosphor BronzeThermoplastic-
7-1437529-6
7-1437529-6
1+8.23529
10+7.8902
50+6.86137
100+6.51833
250+5.83216
Increments of 1
99HH-D5T-FIKCONN IC DIP SOCKET 8POS GOLDTube500ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold-Copper AlloyThrough HoleClosed FrameSolder0.100 2.54mm Gold-Copper Alloy--55°C ~ 125°C
124-83-308-41-002101
124-83-308-41-002101
477+1.0355
Increments of 477
Leadtime
2-3 weeks		0UM-BCG-GDXCONN IC DIP SOCKET 8POS GOLDTube124ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
A 28-LC 7-T
A 28-LC 7-T
17+0.395039
Increments of 17
99DBP-I03S-11CONN IC DIP SOCKET 28POS TINTube-ActiveDIP, 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Tin60µin 1.52µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin60µin 1.52µm Phosphor BronzePolybutylene Terephthalate PBT -55°C ~ 85°C
1437522-4
1437522-4
1008+24.2622
Increments of 1008
33D4X-ZU-3CVSTAMPED PIN-*Active---------------
KGG8L-P6-U8T
KGG8L-P6-U8T
1+0.235294
10+0.22451
25+0.191373
50+0.167451
100+0.15549
Increments of 1
Leadtime
2-3 weeks		0AWY-A9-66GCONN IC DIP SOCKET 6POS TINTube-ActiveDIP, 0.3 7.62mm Row Spacing6 2 x 3 0.100 2.54mm Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin-Phosphor BronzePolybutylene Terephthalate PBT -55°C ~ 85°C
110-93-316-41-605000
110-93-316-41-605000
100+1.83706
300+1.63333
500+1.35373
Increments of 100
Leadtime
2-3 weeks		XB4IA-VIP-F8CONN IC DIP SOCKET 16POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing16 2 x 8 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
510-83-149-15-063101
510-83-149-15-063101
56+9.29937
Increments of 56
Leadtime
2-3 weeks		0MU-MKWW-UVCONN SOCKET PGA 149POS GOLDBulk510ActivePGA149 15 x 15 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
QW5-6G3M-D21
QW5-6G3M-D21
66L-H4T4-PXCONN SOCKET PGA ZIF 478POS GOLD--ObsoletePGA, ZIF ZIP 478 26 x 26 0.050 1.27mm Gold30µin 0.76µm Copper AlloySurface MountOpen FrameSolder0.050 1.27mm Gold30µin 0.76µm Copper AlloyThermoplastic-
110-93-324-41-105000
110-93-324-41-105000
64+11.182
128+7.38197
512+2.99853
Increments of 64
Leadtime
2-3 weeks		SYZ-3F8-ZGCCONN IC DIP SOCKET 24POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
2-2129710-7
2-2129710-7
1+36.2745
10+32.7451
50+29.4118
100+28.4314
250+26.8627
Increments of 1
Leadtime
2-3 weeks		0VU2-PHN-PZLEFT SIDE LGA3647-1 SOCKET-P1-*Active---------------
28-3574-11
28-3574-11
11+15.3387
Increments of 11
Leadtime
2-3 weeks		IJ0R-O0-CHVCONN IC DIP SOCKET ZIF 28POS GLDBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing28 2 x 14 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
2-641615-4
2-641615-4
Leadtime
2-3 weeks		G3A9C-3Y-P5GCONN IC DIP SOCKET 28POS GOLDTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
243-14-1-03
243-14-1-03
1+0.235294
10+0.220588
50+0.164706
100+0.152941
250+0.135294
Increments of 1
Leadtime
2-3 weeks		GN9-0R-9ROCONN IC DIP SOCKET 14POS TINTube-ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin60µin 1.52µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin60µin 1.52µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-40°C ~ 105°C
824-AG11D
824-AG11D
2000+4.68257
Increments of 2000
Leadtime
2-3 weeks		FM7R-E3-0PFCONN IC DIP SOCKET 24POS GOLDTube800ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold25µin 0.63µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
24-81000-610C
24-81000-610C
8+12.5098
Increments of 8
Leadtime
2-3 weeks		JTZ1-MODF-AYUCONN IC DIP SOCKET 24POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
517-87-401-19-101111
517-87-401-19-101111
20+21.1789
Increments of 20
Leadtime
2-3 weeks		AI-NW9R-RPCONN SOCKET PGA 401POS GOLDBulk517ActivePGA401 19 x 19 0.050 1.27mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.050 1.27mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
25-0501-21
25-0501-21
9+12.902
Increments of 9
Leadtime
2-3 weeks		OT4X-3AG-KBECONN SOCKET SIP 25POS GOLDBulk501ActiveSIP25 1 x 25 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C