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Crystals, Oscillators, Resonators Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Packaging | Series | Part Status | Type | Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature ... | Current - Supply ... | Size / Dimension | Height | Package / Case | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DSC400-3333Q0001KI1T | DSC400-3333Q0001KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3333Q0001KI1 | DSC400-3333Q0001KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3333Q0001KE2T | DSC400-3333Q0001KE2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3333Q0001KE2 | DSC400-3333Q0001KE2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3333Q0001KE1T | DSC400-3333Q0001KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3333Q0001KE1 | DSC400-3333Q0001KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KI2T | DSC400-2222Q0022KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KI2 | DSC400-2222Q0022KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KI1T | DSC400-2222Q0022KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KI1 | DSC400-2222Q0022KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KE2T | DSC400-2222Q0022KE2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KE2 | DSC400-2222Q0022KE2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KE1T | DSC400-2222Q0022KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0022KE1 | DSC400-2222Q0022KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KI2T | DSC400-1444Q0060KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KI2 | DSC400-1444Q0060KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KI1T | DSC400-1444Q0060KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KI1 | DSC400-1444Q0060KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KE2T | DSC400-1444Q0060KE2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KE2 | DSC400-1444Q0060KE2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KE1T | DSC400-1444Q0060KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0060KE1 | DSC400-1444Q0060KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1444Q0052KE1T | DSC400-1444Q0052KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
DSC400-1444Q0052KE1 | DSC400-1444Q0052KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0058KI1T | DSC400-0404Q0058KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
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