Online Electronic Components
Easy Board 
Development Board 
GSM / 3G / LTE / IoT Module 
GNSS Module 
Short Range Module 
GPS / GSM / 3G / Wifi / ISM Antenna 
Memory & Data Acquisition IC 
Clock/Timing & Linear IC 
Power Management IC 
Digital Logic IC 
Interface IC 
Embedded MCU 
Discrete Semiconductor 
Resistors 
Potentiometers, Variable Resistors 
Capacitors 
Optoelectronics 
Crystals, Oscillators, Resonators Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Packaging | Series | Part Status | Type | Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature ... | Current - Supply ... | Size / Dimension | Height | Package / Case | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DSC400-0404Q0058KI1 | DSC400-0404Q0058KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0058KE2T | DSC400-0404Q0058KE2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0058KE2 | DSC400-0404Q0058KE2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0058KE1T | DSC400-0404Q0058KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0058KE1 | DSC400-0404Q0058KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0007KE1T | DSC400-0404Q0007KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0007KE1 | DSC400-0404Q0007KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0344Q0051KI1T | DSC400-0344Q0051KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0344Q0051KI1 | DSC400-0344Q0051KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0344Q0051KE1T | DSC400-0344Q0051KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0344Q0051KE1 | DSC400-0344Q0051KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC2311KM1-R0036T | DSC2311KM1-R0036T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 25MHz | 20MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -55°C ~ 125°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KM1-R0036 | DSC2311KM1-R0036 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | 25MHz | 20MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -55°C ~ 125°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL2-R0015T | DSC2311KL2-R0015T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 24MHz | 25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL2-R0015 | DSC2311KL2-R0015 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | 24MHz | 25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL2-R0009T | DSC2311KL2-R0009T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 25MHz | 25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL2-R0009 | DSC2311KL2-R0009 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | 25MHz | 25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL1-R0021T | DSC2311KL1-R0021T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 25MHz | 50MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL1-R0021 | DSC2311KL1-R0021 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | 25MHz | 50MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI2-R0034T | DSC2311KI2-R0034T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 33.3333MHz | 26.041641MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI2-R0034 | DSC2311KI2-R0034 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | 33.3333MHz | 26.041641MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI2-R0029T | DSC2311KI2-R0029T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 130MHz | 130MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI2-R0029 | DSC2311KI2-R0029 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | 130MHz | 130MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI1-R0030T | DSC2311KI1-R0030T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 32MHz | 12MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI1-R0030 | DSC2311KI1-R0030 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | 32MHz | 12MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
English
Vietnam
