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Crystals, Oscillators, Resonators Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Packaging | Series | Part Status | Type | Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature ... | Current - Supply ... | Size / Dimension | Height | Package / Case | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DSC2011FL1-E0002T | DSC2011FL1-E0002T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2011 | Active | MEMS (Silicon) | 100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FL1-E0002 | DSC2011FL1-E0002 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FI2-F0017T | DSC2011FI2-F0017T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2011 | Active | MEMS (Silicon) | 24MHz | 100MHz, 200MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FI2-F0017 | DSC2011FI2-F0017 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 24MHz | 100MHz, 200MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FI2-F0016T | DSC2011FI2-F0016T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2011 | Active | MEMS (Silicon) | 25MHz | 50MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FI2-F0016 | DSC2011FI2-F0016 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 25MHz | 50MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FI1-F0017T | DSC2011FI1-F0017T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2011 | Active | MEMS (Silicon) | 24MHz | 100MHz, 200MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FI1-F0017 | DSC2011FI1-F0017 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 24MHz | 100MHz, 200MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FE2-F0016T | DSC2011FE2-F0016T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2011 | Active | MEMS (Silicon) | 25MHz | 50MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
| DSC2011FE2-F0016 | DSC2011FE2-F0016 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 25MHz | 50MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||||||||||
DSC2010FI2-B0005T | DSC2010FI2-B0005T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2010 | Active | MEMS (Silicon) | 24MHz, 27MHz, 74.25MHz, 148.5MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FI2-B0005 | DSC2010FI2-B0005 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2010 | Active | MEMS (Silicon) | 24MHz, 27MHz, 74.25MHz, 148.5MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FI2-B0004T | DSC2010FI2-B0004T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2010 | Active | MEMS (Silicon) | 106.25MHz, 125MHz, 155.52MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.89mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FI2-B0004 | DSC2010FI2-B0004 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2010 | Active | MEMS (Silicon) | 106.25MHz, 125MHz, 155.52MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.89mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FE2-B0008T | DSC2010FE2-B0008T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2010 | Active | MEMS (Silicon) | 66.6666MHz, 83.3333MHz, 100MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FE2-B0008 | DSC2010FE2-B0008 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2010 | Active | MEMS (Silicon) | 66.6666MHz, 83.3333MHz, 100MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FE2-B0007T | DSC2010FE2-B0007T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2010 | Active | MEMS (Silicon) | 22.768MHz, 24.576MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FE2-B0007 | DSC2010FE2-B0007 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2010 | Active | MEMS (Silicon) | 22.768MHz, 24.576MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
DSC2010FE2-B0003T | DSC2010FE2-B0003T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2010 | Active | MEMS (Silicon) | 125MHz, 155.52MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
| DSC2010FE2-B0003 | DSC2010FE2-B0003 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2010 | Active | MEMS (Silicon) | 125MHz, 155.52MHz | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-VFQFN Exposed Pad | |||||||||||
DSC400-4444Q0038KI1 | DSC400-4444Q0038KI1 |
| Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | ||||||||||
| DSC400-4444Q0031KE1 | DSC400-4444Q0031KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||||||||||
| DSC400-4444Q0030KI1 | DSC400-4444Q0030KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||||||||||
| DSC400-4444Q0024KE1 | DSC400-4444Q0024KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||||||||||
| DSC400-4444Q0023KE1 | DSC400-4444Q0023KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||||||||||
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