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Crystals, Oscillators, Resonators Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Packaging | Series | Part Status | Type | Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature ... | Current - Supply ... | Size / Dimension | Height | Package / Case | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DSC400-4444Q0022KE1 | DSC400-4444Q0022KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0015KE2 | DSC400-4444Q0015KE2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0015KE1 | DSC400-4444Q0015KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4134Q0050KE1 | DSC400-4134Q0050KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4134Q0028KE1 | DSC400-4134Q0028KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3443Q0022KE1 | DSC400-3443Q0022KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3333Q0041KI2 | DSC400-3333Q0041KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0047KE1 | DSC400-2222Q0047KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1122Q0036KI1 | DSC400-1122Q0036KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS, LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1122Q0036KE1 | DSC400-1122Q0036KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS, LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0044KI2 | DSC400-1111Q0044KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0043KI2 | DSC400-1111Q0043KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0034KI1 | DSC400-1111Q0034KI1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0034KE1 | DSC400-1111Q0034KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0025KE1 | DSC400-1111Q0025KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0019KI2 | DSC400-1111Q0019KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0001KE1 | DSC400-1111Q0001KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0414Q0033KE1 | DSC400-0414Q0033KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0020KE1 | DSC400-0404Q0020KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0333Q0040KI2 | DSC400-0333Q0040KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0333Q0032KE1 | DSC400-0333Q0032KE1 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0331Q0026KI2 | DSC400-0331Q0026KI2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Obsolete | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0111Q0029KE2 | DSC400-0111Q0029KE2 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
DSC2311KL2-R0027 | DSC2311KL2-R0027 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL2-R0018 | DSC2311KL2-R0018 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
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