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Crystals, Oscillators, Resonators Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Packaging | Series | Part Status | Type | Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature ... | Current - Supply ... | Size / Dimension | Height | Package / Case | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DSC2030FI2-C0010 | DSC2030FI2-C0010 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2030 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2030FI2-C0009 | DSC2030FI2-C0009 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2030 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2030FI2-C0006 | DSC2030FI2-C0006 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2030 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2011FM2-E0002 | DSC2011FM2-E0002 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2011FM2-E0001 | DSC2011FM2-E0001 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 24MHz, 25MHz, 27MHz, 48MHz, 50MHz, 54MHz | 24MHz, 27MHz, 50MHz, 54MHz, 125MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2011FM1-E0002 | DSC2011FM1-E0002 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -55°C ~ 125°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2011FE2-E0004 | DSC2011FE2-E0004 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 24MHz, 25MHz, 48MHz, 50MHz, 74.25MHz, 75MHz, 125MHz, 148.5MHz | 24MHz, 25MHz, 48MHz, 50MHz, 74.25MHz, 75MHz, 125MHz, 148.5MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2011FE1-E0005 | DSC2011FE1-E0005 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2011 | Active | MEMS (Silicon) | 25MHz | 25MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2010FI2-A0024 | DSC2010FI2-A0024 | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tube | DSC2010 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
DSC400-4444Q0038KI1T | DSC400-4444Q0038KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0031KE1T | DSC400-4444Q0031KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0030KI1T | DSC400-4444Q0030KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0024KE1T | DSC400-4444Q0024KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0023KE1T | DSC400-4444Q0023KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0022KE1T | DSC400-4444Q0022KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0015KE2T | DSC400-4444Q0015KE2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4444Q0015KE1T | DSC400-4444Q0015KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4134Q0050KE1T | DSC400-4134Q0050KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-4134Q0028KE1T | DSC400-4134Q0028KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3443Q0022KE1T | DSC400-3443Q0022KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-3333Q0041KI2T | DSC400-3333Q0041KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-2222Q0047KE1T | DSC400-2222Q0047KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1122Q0036KI1T | DSC400-1122Q0036KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS, LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1122Q0036KE1T | DSC400-1122Q0036KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS, LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0044KI2T | DSC400-1111Q0044KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
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