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Crystals, Oscillators, Resonators Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Packaging | Series | Part Status | Type | Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature ... | Current - Supply ... | Size / Dimension | Height | Package / Case | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DSC400-1111Q0043KI2T | DSC400-1111Q0043KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0034KI1T | DSC400-1111Q0034KI1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0034KE1T | DSC400-1111Q0034KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0025KE1T | DSC400-1111Q0025KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0019KI2T | DSC400-1111Q0019KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-1111Q0001KE1T | DSC400-1111Q0001KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0414Q0033KE1T | DSC400-0414Q0033KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0404Q0020KE1T | DSC400-0404Q0020KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0333Q0040KI2T | DSC400-0333Q0040KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0333Q0032KE1T | DSC400-0333Q0032KE1T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0331Q0026KI2T | DSC400-0331Q0026KI2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Obsolete | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
| DSC400-0111Q0029KE2T | DSC400-0111Q0029KE2T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC400 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad | |||
DSC2311KL2-R0027T | DSC2311KL2-R0027T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL2-R0018T | DSC2311KL2-R0018T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KL1-R0009T | DSC2311KL1-R0009T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI2-R0020T | DSC2311KI2-R0020T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI1-R0015T | DSC2311KI1-R0015T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI1-R0014T | DSC2311KI1-R0014T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KI1-R0009T | DSC2311KI1-R0009T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KE2-R0008T | DSC2311KE2-R0008T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KE1-R0009T | DSC2311KE1-R0009T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | - | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2311KE1-R0002T | DSC2311KE1-R0002T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2311 | Active | MEMS (Silicon) | 25MHz | 125MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead | |||
| DSC2230FI2-C0007T | DSC2230FI2-C0007T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2230 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2230FI2-C0006T | DSC2230FI2-C0006T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2230 | Active | MEMS (Silicon) | - | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
| DSC2230FI2-C0004T | DSC2230FI2-C0004T | Leadtime 2-3 weeks | Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | Tape & Reel (TR) | DSC2230 | Active | MEMS (Silicon) | 148.35MHz, 148.5MHz | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead | |||
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