Manufacturer | Bergquist |
Series | Hi-Flow® 115-AC |
Part Status | Active |
Usage | TO-218, TO-220, TO-247 |
Shape | Rectangle |
Outline | 21.84mm x 18.79mm |
Thickness | 0.0055" (0.140mm) |
Material | Phase Change Compound |
Adhesive | Adhesive - One Side |
Backing, Carrier | Fiberglass |
Color | Gray |
Thermal Resistivity | 0.35°C/W |
Thermal Conductivity | 0.8 W/m-K |
Standard Package | 100 |
GRAPHITE 225X225X0.050MM WO ADH
TPCM 920 9 X 9
SOFT PGS COMPRESSIBLE TYPE
PC99AL RELAY 87.9X39.1X0.1MM
ULTIMIFLUX 25.4X25.4X1MM
THERMAL PAD .009 GRAY TO-220
H48-6 SHEET 300X300X1MM W ADH
PC99AL RECT 31.8X31.8X0.1MM
THERMAL INTERFACE PAD
TFLEX 3140 0.5X0.5X0.140
H48-6C SHEET 640X320X1MM W ADH
TFLEX 2190V0 9 X 9