ManufacturerPackagingSeriesPart StatusTypeNumber of CircuitsRatio - Input:OutputDifferential - Input:OutputInputOutputFrequency - MaxVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Circuits
Ratio - Input:Output
Differential - Input:Output ...
Input
Output
Frequency - Max
Voltage - Supply
Operating Temperature ...
Mounting Type
Package / Case
Supplier Device Package ...
SY89875UMI-TR
SY89875UMI-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 2GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Divider11:2Yes/YesCML, HSTL, LVDS, LVPECLLVDS2GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89875UMI
SY89875UMI
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 2GHZ 16MLFTubePrecision Edge®Fanout Buffer (Distribution), Divider11:2Yes/YesCML, HSTL, LVDS, LVPECLLVDS2GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89874UMI-TR
SY89874UMI-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 2.5GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Divider11:2Yes/YesCML, HSTL, LVDS, LVPECLLVPECL2.5GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89873LMI-TR
SY89873LMI-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:3 2GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Divider11:3Yes/YesCML, HSTL, LVDS, LVPECLLVDS2GHz2.97 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89872UMI-TR
SY89872UMI-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:3 2GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Divider11:3Yes/YesCML, HSTL, LVDS, LVPECLLVDS2GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89872UMI
SY89872UMI
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:3 2GHZ 16MLFTubePrecision Edge®Fanout Buffer (Distribution), Divider11:3Yes/YesCML, HSTL, LVDS, LVPECLLVDS2GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89871UMI-TR
SY89871UMI-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:3 2.5GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Divider11:3Yes/YesCML, HSTL, LVDS, LVPECLLVPECL2.5GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89858UMG-TR
SY89858UMG-TR
1000+4.30178
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:8 3GHZ 32MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution)11:8Yes/YesCML, LVDS, PECLLVPECL3GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89858UMG
SY89858UMG
1+5.67647
25+4.72588
100+4.30176
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:8 3GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution)11:8Yes/YesCML, LVDS, PECLLVPECL3GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89856UMG-TR
SY89856UMG-TR
1000+4.30178
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:6 3GHZ 32MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:6Yes/YesCML, LVDS, PECLLVPECL3GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89856UMG
SY89856UMG
1+5.67647
25+4.72588
100+4.30176
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:6 3GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:6Yes/YesCML, LVDS, PECLLVPECL3GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89854UMY TR
SY89854UMY TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 3.5GHZ 16MLFTape & Reel (TR)Precision Edge®ObsoleteFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, PECLLVPECL3.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89854UMY
SY89854UMY
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 3.5GHZ 16MLFTubePrecision Edge®ObsoleteFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, PECLLVPECL3.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89854UMI TR
SY89854UMI TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 3.5GHZ 16MLFTape & Reel (TR)Precision Edge®ObsoleteFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, PECLLVPECL3.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89854UMI
SY89854UMI
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 3.5GHZ 16MLFTrayPrecision Edge®ObsoleteFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, PECLLVPECL3.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89854UMG-TR
SY89854UMG-TR
1000+1.90854
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 3.5GHZ 16MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, PECLLVPECL3.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89854UMG
SY89854UMG
1+2.52941
25+2.10039
100+1.90853
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 3.5GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, PECLLVPECL3.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89853UMG-TR
SY89853UMG-TR
1000+3.04962
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK MULTIPLX 2:1 2.5GHZ 32MLFTape & Reel (TR)Precision Edge®ActiveMultiplexer22:1Yes/YesCML, LVDS, PECLLVPECL2.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89853UMG
SY89853UMG
1+4.02941
25+3.35255
100+3.04961
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK MULTIPLX 2:1 2.5GHZ 32MLFTrayPrecision Edge®ActiveMultiplexer22:1Yes/YesCML, LVDS, PECLLVPECL2.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89851UMG-TR
SY89851UMG-TR
1000+1.90854
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 4GHZ 16MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, PECLLVPECL4GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89851UMG
SY89851UMG
1+2.52941
25+2.10039
100+1.90853
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 4GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, PECLLVPECL4GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89838UMG-TR
SY89838UMG-TR
1000+4.88747
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:8 2GHZ 32MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:8Yes/YesCML, LVDS, LVPECLLVDS2GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89838UMG
SY89838UMG
1+6.44118
25+5.37216
100+4.88745
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:8 2GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:8Yes/YesCML, LVDS, LVPECLLVDS2GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89834UMI-TR
SY89834UMI-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:4 1GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Multiplexer, Translator12:4No/YesLVCMOS, LVTTLLVPECL1GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89834UMI
SY89834UMI
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:4 1GHZ 16MLFTubePrecision Edge®Fanout Buffer (Distribution), Multiplexer, Translator12:4No/YesLVCMOS, LVTTLLVPECL1GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)