ManufacturerPackagingSeriesPart StatusTypeNumber of CircuitsRatio - Input:OutputDifferential - Input:OutputInputOutputFrequency - MaxVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Circuits
Ratio - Input:Output
Differential - Input:Output ...
Input
Output
Frequency - Max
Voltage - Supply
Operating Temperature ...
Mounting Type
Package / Case
Supplier Device Package ...
SY58013UMI
SY58013UMI
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 6GHZ 16MLFTubePrecision Edge®ObsoleteFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLLVPECL6GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58012UMI-TR
SY58012UMI-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 5GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLLVPECL5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58012UMI
SY58012UMI
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 5GHZ 16MLFTrayPrecision Edge®Fanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLLVPECL5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58012UMG-TR
SY58012UMG-TR
1000+6.98784
Increments of 1000
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 5GHZ 16MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLLVPECL5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58012UMG
SY58012UMG
1+9.21569
25+7.67451
100+6.98784
Increments of 1
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 5GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLLVPECL5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58011UMI-TR
SY58011UMI-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 8GHZ 16MLFTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLCML8GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58011UMI
SY58011UMI
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 8GHZ 16MLFTrayPrecision Edge®Fanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLCML8GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58011UMG-TR
SY58011UMG-TR
1000+6.98784
Increments of 1000
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 8GHZ 16MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLCML8GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY58011UMG
SY58011UMG
1+9.21569
25+7.67451
100+6.98784
Increments of 1
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 8GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVDS, LVPECLCML8GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY10H842ZC-TR
SY10H842ZC-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:4 160MHZ 16SOICTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution)11:4Yes/YesPECLTTL160MHz4.75 V ~ 5.25 V0°C ~ 85°CSurface Mount16-SOIC (0.295", 7.50mm Width)16-SOIC
SY10H842ZC
SY10H842ZC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:4 160MHZ 16SOICTubePrecision Edge®Fanout Buffer (Distribution)11:4Yes/YesPECLTTL160MHz4.75 V ~ 5.25 V0°C ~ 85°CSurface Mount16-SOIC (0.295", 7.50mm Width)16-SOIC
SY10H842LZC-TR
SY10H842LZC-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:4 160MHZ 16SOICTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution)11:4Yes/YesPECLTTL160MHz3 V ~ 3.6 V0°C ~ 85°CSurface Mount16-SOIC (0.295", 7.50mm Width)16-SOIC
SY10H842LZC
SY10H842LZC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:4 160MHZ 16SOICTubePrecision Edge®Fanout Buffer (Distribution)11:4Yes/YesPECLTTL160MHz3 V ~ 3.6 V0°C ~ 85°CSurface Mount16-SOIC (0.295", 7.50mm Width)16-SOIC
SY10H841ZC-TR
SY10H841ZC-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:4 160MHZ 16SOICTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution)11:4Yes/YesPECLTTL160MHz4.75 V ~ 5.25 V0°C ~ 85°CSurface Mount16-SOIC (0.295", 7.50mm Width)16-SOIC
SY10H841ZC
SY10H841ZC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:4 160MHZ 16SOICTubePrecision Edge®Fanout Buffer (Distribution)11:4Yes/YesPECLTTL160MHz4.75 V ~ 5.25 V0°C ~ 85°CSurface Mount16-SOIC (0.295", 7.50mm Width)16-SOIC
SY10H841LZC
SY10H841LZC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:4 160MHZ 16SOICTubePrecision Edge®Fanout Buffer (Distribution)11:4Yes/YesPECLTTL160MHz3 V ~ 3.6 V0°C ~ 85°CSurface Mount16-SOIC (0.295", 7.50mm Width)16-SOIC
SY10H646LJC-TR
SY10H646LJC-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 2:8 160MHZ 28PLCCTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution), Multiplexer12:8Yes/YesPECL, TTLTTL160MHz3 V ~ 3.6 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
SY10H646LJC
SY10H646LJC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 2:8 160MHZ 28PLCCTubePrecision Edge®Fanout Buffer (Distribution), Multiplexer12:8Yes/YesPECL, TTLTTL160MHz3 V ~ 3.6 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
SY10H641JC-TR
SY10H641JC-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:9 135MHZ 28PLCCTape & Reel (TR)Precision Edge®Fanout Buffer (Distribution)11:9Yes/YesPECLTTL135MHz4.75 V ~ 5.25 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
SY10H641JC
SY10H641JC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:9 135MHZ 28PLCCTubePrecision Edge®Fanout Buffer (Distribution)11:9Yes/YesPECLTTL135MHz4.75 V ~ 5.25 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
SY10H641AJC
SY10H641AJC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:9 80MHZ 28PLCCTubePrecision Edge®Fanout Buffer (Distribution)11:9Yes/YesPECLTTL80MHz4.75 V ~ 5.25 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
SY10EP11UZI-TR
SY10EP11UZI-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 3GHZ 8SOICTape & Reel (TR)100EP, ECL Pro®Fanout Buffer (Distribution)11:2Yes/YesLVECL, LVPECLLVECL, LVPECL3GHz2.375 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
SY10EP11UZI
SY10EP11UZI
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 3GHZ 8SOICTube100EP, ECL Pro®Fanout Buffer (Distribution)11:2Yes/YesLVECL, LVPECLLVECL, LVPECL3GHz2.375 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
SY10EP11UZC
SY10EP11UZC
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 3GHZ 8SOICTube100EP, ECL Pro®Fanout Buffer (Distribution)11:2Yes/YesLVECL, LVPECLLVECL, LVPECL3GHz2.375 V ~ 5.5 V0°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
SY10EP11UKI-TR
SY10EP11UKI-TR
Leadtime
2-3 weeks
Microchip TechnologyIC CLK BUFFER 1:2 3GHZ 8MSOPTape & Reel (TR)100EP, ECL Pro®Fanout Buffer (Distribution)11:2Yes/YesLVECL, LVPECLLVECL, LVPECL3GHz2.375 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-TSSOP, 8-MSOP (0.118", 3.00mm Width)8-MSOP