ManufacturerPackagingSeriesPart StatusTypeNumber of CircuitsRatio - Input:OutputDifferential - Input:OutputInputOutputFrequency - MaxVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Circuits
Ratio - Input:Output
Differential - Input:Output ...
Input
Output
Frequency - Max
Voltage - Supply
Operating Temperature ...
Mounting Type
Package / Case
Supplier Device Package ...
LMV112SD/NOPB-Cut
LMV112SD/NOPB
1+1.13725
10+1.01863
100+0.794314
500+0.656177
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:1 40MHZ 8WSONCut Tape (CT)-ActiveBuffer/Driver21:1No/NoClockClock40MHz2.4 V ~ 5 V-40°C ~ 85°CSurface Mount8-WFDFN Exposed Pad8-WSON (3x3)
LMV112SD/NOPB
LMV112SD/NOPB
1000+0.419118
Increments of 1000
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:1 40MHZ 8WSONTape & Reel (TR)-ActiveBuffer/Driver21:1No/NoClockClock40MHz2.4 V ~ 5 V-40°C ~ 85°CSurface Mount8-WFDFN Exposed Pad8-WSON (3x3)
MC100EP14DTG
MC100EP14DTG
1+9.33333
10+8.43137
100+6.98039
500+6.07843
1000+5.29412
Increments of 1
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 2:5 2GHZ 20TSSOPTube100EPActiveFanout Buffer (Distribution), Multiplexer12:5Yes/YesECL, HSTL, PECLECL, PECL2GHz3 V ~ 5.5 V-40°C ~ 85°CSurface Mount20-TSSOP (0.173", 4.40mm Width)20-TSSOP
CDCP1803RGET-Cut
CDCP1803RGET
1+7.89216
10+7.13235
100+5.90461
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:3 800MHZ 24QFNCut Tape (CT)-ActiveFanout Buffer (Distribution), Divider, Multiplexer11:3Yes/YesCML, HSTL, LVCMOS, LVDS, LVTTL, SSTL-2, VMLLVPECL800MHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount24-VFQFN Exposed Pad24-VQFN (4x4)
CDCM1804RGET-Cut
CDCM1804RGET
1+12.9804
10+11.9275
100+10.0734
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:4 800MHZ 24QFNCut Tape (CT)-ActiveFanout Buffer (Distribution), Divider, Multiplexer11:4Yes/YesCML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VMLLVCMOS, LVPECL800MHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount24-VFQFN Exposed Pad24-VQFN (4x4)
CDC2351MDBREP-Cut
CDC2351MDBREP
1+18.7647
10+17.248
100+14.567
500+12.9583
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:10 100MHZ 24SSOPCut Tape (CT)-ActiveFanout Buffer (Distribution)11:10No/NoLVTTLLVTTL100MHz3 V ~ 3.6 V-55°C ~ 125°CSurface Mount24-SSOP (0.209", 5.30mm Width)24-SSOP
CDCP1803RGET
CDCP1803RGET
250+5.47502
500+4.99192
1250+4.02573
Increments of 250
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:3 800MHZ 24QFNTape & Reel (TR)-ActiveFanout Buffer (Distribution), Divider, Multiplexer11:3Yes/YesCML, HSTL, LVCMOS, LVDS, LVTTL, SSTL-2, VMLLVPECL800MHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount24-VFQFN Exposed Pad24-VQFN (4x4)
CDCM1804RGET
CDCM1804RGET
250+9.3
500+8.7
1250+7.5
Increments of 250
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:4 800MHZ 24QFNTape & Reel (TR)-ActiveFanout Buffer (Distribution), Divider, Multiplexer11:4Yes/YesCML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VMLLVCMOS, LVPECL800MHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount24-VFQFN Exposed Pad24-VQFN (4x4)
CDC2351MDBREP
CDC2351MDBREP
2000+11.1059
Increments of 2000
Leadtime
2-3 weeks		Texas InstrumentsIC CLK BUFFER 1:10 100MHZ 24SSOPTape & Reel (TR)-ActiveFanout Buffer (Distribution)11:10No/NoLVTTLLVTTL100MHz3 V ~ 3.6 V-55°C ~ 125°CSurface Mount24-SSOP (0.209", 5.30mm Width)24-SSOP
SY100EL11VZG-TR-Cut
SY100EL11VZG-TR
1+2.66667
25+2.22157
100+2.01961
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 8SOICCut Tape (CT)100EL, Precision Edge®ActiveFanout Buffer (Distribution)11:2Yes/YesClockClock-3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
SY100E111LJG TR-Cut
SY100E111LJG TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:9 28PLCCCut Tape (CT)100E, Precision Edge®ObsoleteFanout Buffer (Distribution)11:9Yes/YesPECLPECL-3 V ~ 5.5 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
SY89874UMG
SY89874UMG
1+6.31373
25+5.26118
100+4.78647
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 2.5GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Divider11:2Yes/YesCML, HSTL, LVDS, LVPECLLVPECL2.5GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89873LMG
SY89873LMG
1+5.67647
25+4.72588
100+4.30176
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:3 2GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Divider11:3Yes/YesCML, HSTL, LVDS, LVPECLLVDS2GHz2.97 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89871UMG
SY89871UMG
1+8.12745
25+6.76588
100+6.1598
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:3 2.5GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Divider11:3Yes/YesCML, HSTL, LVDS, LVPECLLVPECL2.5GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89833LMG
SY89833LMG
1+5.85294
25+4.88745
100+4.44314
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 2GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, LVPECLLVDS2GHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89832UMG
SY89832UMG
1+5.85294
25+4.88745
100+4.44314
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 2.5GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, LVPECLLVDS2.5GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89831UMG
SY89831UMG
1+5.85294
25+4.88745
100+4.44314
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 2GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, LVPECLLVPECL2GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89830UK4G
SY89830UK4G
1+4.08824
25+3.41333
100+3.1001
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:4 2.5GHZ 16TSSOPTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:4Yes/YesHSTL, LVECL, LVPECLLVECL, LVPECL2.5GHz2.375 V ~ 5.5 V-40°C ~ 85°CSurface Mount16-TSSOP (0.173", 4.40mm Width)16-TSSOP
SY89823LHG
SY89823LHG
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 500MHZ 64TQFPTrayPrecision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer, Translator12:22Yes/YesHSTL, LVPECLHSTL500MHz3.15 V ~ 3.45 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89200UMG
SY89200UMG
1+7.57843
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:8 1.5GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Divider, Multiplexer11:8Yes/YesCML, LVDS, PECLLVDS1.5GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89112UMG
SY89112UMG
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:12 3GHZ 44MLFTubePrecision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer12:12Yes/YesCML, LVDS, LVPECLLVPECL3GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount44-VFQFN Exposed Pad, 44-MLF®44-MLF® (7x7)
SY58036UMG
SY58036UMG
1+9.78431
25+8.14902
100+7.41196
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:6 7GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:6Yes/YesCML, LVDS, PECLLVPECL7GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY58035UMG
SY58035UMG
1+9.78431
25+8.14902
100+7.41196
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:6 5.5GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:6Yes/YesCML, LVDS, PECLLVPECL5.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY58034UMG
SY58034UMG
1+9.78431
25+8.14902
100+7.41196
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:6 7.5GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:6Yes/YesCML, LVDS, PECLCML7.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY58033UMG
SY58033UMG
1+9.57843
25+7.97765
100+7.26049
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:8 5.5GHZ 32MLFTrayPrecision Edge®ActiveFanout Buffer (Distribution)11:8Yes/YesCML, LVDS, LVPECLLVPECL5.5GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)