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GSM / 3G / LTE / IoT Module 
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| Manufacturer | Chip Quik Inc. |
| Series | Proto-Advantage |
| Part Status | Active |
| Type | LGA |
| Number of Positions | 14 |
| Pitch | 0.031" (0.80mm) |
| Outer Dimension | 0.900" L x 1.300" W (22.86mm x 33.02mm) |
| Inner Dimension | 0.118" L x 0.197" W (3.00mm x 5.00mm) |
| Thermal Center Pad | - |
| Material | Stainless Steel |
| Standard Package | 1 |
QFN 32 STENCIL
MLP MLF-16 STENCIL
SSOP-36 STENCIL
QFN 10 STENCIL
DFN-12 STENCIL
FPC FFC SMT CONN STENCIL
SOIC-20 STENCIL
QFN-32 STENCIL
SOP-40 STENCIL
SOT-563F STENCIL
SOIC-32 STENCIL
TSOP-54 II STENCIL
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