Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SMD291SNL250T3![]() | SMD291SNL250T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T3 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 250g (9 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
SMD291AX250T3![]() | SMD291AX250T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63/PB37 250G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Jar, 250g (9 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
SMDLTLFP500T3 | SMDLTLFP500T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN42/BI58 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | Jar, 500g (17 oz) | 281°F (138°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
SMD291SNL500T5 | SMD291SNL500T5 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 500G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 500g (17 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
SMD291SNL500T3 | SMD291SNL500T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 500g (17 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
SMD291AX500T5 | SMD291AX500T5 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63/PB37 500G T5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Jar, 500g (17 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
SMD291AX500T3 | SMD291AX500T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63/PB37 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Jar, 250g (9 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
SMDLTLFP![]() | SMDLTLFP |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP 5CC W/TIP | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | Syringe, 15g (0.5 oz) | 281°F (138°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
583489![]() | 583489 | Leadtime 2-3 weeks | Multicore | 63/37 MP200 SOLDER FLUX 25GM | MP200 | Obsolete | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Cartridge, 25g (0.9 oz) | 361°F (183°C) | 6 Months (Date of Manufacture) | |||||||||||||||
395439![]() | 395439 |
| Leadtime 2-3 weeks | Multicore | HMP 366 3% .050DIA./18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated (RA) | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 16 AWG, 18 SWG | 0.05" (1.27mm) | 0.033 | Spool, 454g (1 lb) | 565 ~ 574°F (296 ~ 301°C) | No Shelf Life | ||||||||||||||
395437![]() | 395437 |
| Leadtime 2-3 weeks | Multicore | HMP 366 3% .028DIA./22SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated (RA) | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 21 AWG, 22 SWG | 0.028" (0.71mm) | 0.033 | Spool, 454g (1 lb) | 565 ~ 574°F (296 ~ 301°C) | No Shelf Life | ||||||||||||||
397952![]() | 397952 |
| Leadtime 2-3 weeks | Multicore | HMP 366 3% .022DIA./24SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated (RA) | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 23 AWG, 24 SWG | 0.022" (0.56mm) | 0.033 | Spool, 227g (1/2 lb) | 565 ~ 574°F (296 ~ 301°C) | No Shelf Life | ||||||||||||||
554889![]() | 554889 |
| Leadtime 2-3 weeks | Multicore | 63/37 BAR SOLDER - 2LB BAR | - | Obsolete | Leaded | Bar Solder | - | Sn63Pb37 (63/37) | - | - | - | Bar, 907g (2 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
680290![]() | 680290 |
| Leadtime 2-3 weeks | Multicore | 99C BAR SOLDER 2LB | - | Obsolete | Lead Free | Bar Solder | - | Sn99.3Cu0.7 (99.3/0.7) | - | - | - | Bar, 907g (2 lb) | 440°F (227°C) | No Shelf Life | ||||||||||||||
981501![]() | 981501 |
| Leadtime 2-3 weeks | Multicore | SAC305 TRI BAR SOLDR - 2.5LB | - | Obsolete | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Bar, 1.1kg (2.5lbs) | 423 ~ 428°F (217 ~ 220°C) | - | ||||||||||||||
732977 | 732977 |
| Leadtime 2-3 weeks | Multicore | 97SC HYDRO-X 2% .064DIA/16SWG | Hydro-X | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | 0.064" (1.63mm) | 0.022 | Spool, 454g (1 lb) | 423 ~ 428°F (217 ~ 220°C) | No Shelf Life | ||||||||||||||
386820![]() | 386820 |
| Leadtime 2-3 weeks | Multicore | 63/37 HYDRO-X 2% .022DIA/24SWG | Hydro-X | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 (63/37) | 23 AWG, 24 SWG | 0.022" (0.56mm) | 0.022 | Spool, 227g (1/2 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
MM01075![]() | MM01075 | Leadtime 2-3 weeks | Multicore | 63/37 HYDRO-X 2% .024DIA/23SWG | Hydro-X | Obsolete | Leaded | Wire Solder | Water Soluble | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | 0.024" (0.61mm) | 0.022 | Spool, 454g (1 lb) | 361°F (183°C) | No Shelf Life | |||||||||||||||
386818![]() | 386818 |
| Leadtime 2-3 weeks | Multicore | 63/37 HYDRO-X 2% .032DIA/21SWG | Hydro-X | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | 0.032" (0.81mm) | 0.022 | Spool, 454g (1 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
397982![]() | 397982 |
| Leadtime 2-3 weeks | Multicore | 63/37 CRYSL 502 3% .015DIA/28SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 26 AWG, 27 SWG | 0.015" (0.39mm) | 0.033 | Spool, 227g (1/2 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
395465![]() | 395465 |
| Leadtime 2-3 weeks | Multicore | 63/37 CRYSL 502 3% .064DIA/16SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | 0.064" (1.63mm) | 0.033 | Spool, 454g (1 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
386851![]() | 386851 |
| Leadtime 2-3 weeks | Multicore | 63/37 CRYSL 502 2% .022DIA/24SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 23 AWG, 24 SWG | 0.022" (0.56mm) | 0.022 | Spool, 454g (1 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
386862![]() | 386862 |
| Leadtime 2-3 weeks | Multicore | 63/37 CRYSL 502 2% .032DIA/21SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | 0.032" (0.81mm) | 0.022 | Spool, 454g (1 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
395451![]() | 395451 |
| Leadtime 2-3 weeks | Multicore | 63/37 CRYSL 502 3% .032DIA/21SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | 0.032" (0.81mm) | 0.033 | Spool, 454g (1 lb) | 361°F (183°C) | No Shelf Life | ||||||||||||||
796065![]() | 796065 |
| Leadtime 2-3 weeks | Multicore | 97SC 400 2% .015DIA 26AWG 27SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | 26 AWG, 27 SWG | 0.015" (0.39mm) | 0.022 | - | 423 ~ 428°F (217 ~ 220°C) | No Shelf Life |